The role focuses on optimizing D2W hybrid bonding processes to improve product yield and develop innovative process flows
Job Summary
The role focuses on optimizing D2W hybrid bonding processes to improve product yield and develop innovative process flows.
Candidates must possess significant practical experience in solving complex process issues within front-end or backend wafer fabrication environments.
The position requires close collaboration with internal teams, partners, and customers to define new process flows and support technical feasibility studies.
Matching Summary
Match Score: 85
The role focuses on optimizing D2W hybrid bonding processes to improve product yield and develop innovative process flows.
Skills & Requirements
Must-have
5+ years C2W or W2W hybrid bonding experience
Front end wafer fab process expertise
DOE execution and data analysis skills
Defectivity and yield engineering knowledge
JMP or Matlab software proficiency
Nice-to-have
Strong technical documentation abilities
Customer site problem solving experience
Structured knowledge transfer capability
Innovating process flow development
Key Requirements
Master's degree in mechanical/electrical/electronics/physics or PhD
Minimum 5 years relevant experience in hybrid bonding
Hands-on experience with semiconductor equipment and defectivity engineering