Lead Principal Engineer Package Technology Development
INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD
Singapore
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Mems package technology development
Silicon microphone back-end assembly
Process development and optimization
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Infineon Technologies is seeking a Lead Principal Engineer for Package Technology Development specializing in Micro Electro-Mechanical Systems (MEMS) in Singapore. The role involves leading MEMS package technology projects, overseeing a global team, and ensuring successful execution from concept to high-volume production while collaborating closely with key customers.
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Job Summary
Drive the full lifecycle of MEMS Package Technology Development from concept to high-volume ramp-up.
Act as the primary technical lead and point of contact for direct communication with key customers regarding MEMS package solutions.
Lead a global team of process development engineers to execute multiple New Product Introduction projects while fostering professional growth.
Matching Summary
Match Score: 75
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Infineon Technologies is seeking a Lead Principal Engineer for Package Technology Development specializing in Micro Electro-Mechanical Systems (MEMS) in Singapore. The role involves leading MEMS package technology projects, overseeing a global team, and ensuring successful execution from concept to high-volume production while collaborating closely with key customers.
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Skills & Requirements
Must-have
MEMS package technology development
Silicon Microphone back-end assembly
Process development and optimization
OSAT collaboration experience
Failure Analysis and Reliability Engineering
Nice-to-have
Team leadership and mentorship skills
Direct Tier 1 customer communication
Innovative concept generation
Strong analytical problem-solving abilities
Key Requirements
Bachelor's Degree in Engineering
Minimum 12 years of relevant experience
Proven track record in MEMS Silicon Microphone technologies