Not specified; not specified; competitive pyy + be...
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Bachelor's degree in engineering
Die attach asm ad8312fc machine platform
Mold towa ypm1180 machine platform
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Texas Instruments is seeking a Flipchip CSP Manufacturing Process Engineer in Baguio City, Philippines. The ideal candidate will have a passion for process improvement and the ability to drive results in a fast-paced environment, while being responsible for the development and qualification of new devices and technologies.
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Job Summary
This position provides the opportunity to drive continual improvement at all levels within a team focused on improved procedures and processes.
You will be responsible for defining, developing, qualifying, and ramping new devices, packages, and technologies to production for FCCSP packages.
Texas Instruments offers competitive pay and benefits designed to help employees live their best life while empowering them to own their career development.
Matching Summary
Match Score: 75
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Texas Instruments is seeking a Flipchip CSP Manufacturing Process Engineer in Baguio City, Philippines. The ideal candidate will have a passion for process improvement and the ability to drive results in a fast-paced environment, while being responsible for the development and qualification of new devices and technologies.
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Salary
Not specified; Not specified; Competitive pay and benefits offered
Skills & Requirements
Must-have
Bachelor's degree in Engineering
Die Attach ASM AD8312FC machine platform
Mold TOWA YPM1180 machine platform
Ball Attach SSP BPS8200 machine platform
Nanojet Nano-800/Nano-1000D machine platform
FCCSP packaging knowledge
Microsoft Office proficiency
Nice-to-have
Experience with Spotfire analytical software
Program management experience
Strong data mining skills
Ability to work in fast-paced environment
Excellent English communication skills
Key Requirements
Bachelor's degree in Engineering required
Knowledge of specific machine platforms (ASM, TOWA, SSP, Nanojet)
Proficiency in Microsoft Office (PowerPoint and Excel)