Experience with wafer thin wafer dicing techniques
Familiar with assembly and packaging processes
More than 3 years of package process experience
Micron Technology is seeking a Sr Engineer for Package Pre Stacking with expertise in advanced package technology and wafer dicing techniques. The ideal candidate should have over three years of relevant experience and familiarity with various assembly processes and problem-solving methodologies
Job Summary
Micron Technology is a world leader in innovating memory and storage solutions.
The role involves advanced package technology research and development.
Candidates will work with external suppliers to develop equipment and materials.
Matching Summary
Match Score: 85
Micron Technology is seeking a Sr Engineer for Package Pre Stacking with expertise in advanced package technology and wafer dicing techniques. The ideal candidate should have over three years of relevant experience and familiarity with various assembly processes and problem-solving methodologies.
Skills & Requirements
Must-have
Experience with wafer thin wafer dicing techniques
Familiar with assembly and packaging processes
More than 3 years of package process experience
Nice-to-have
Familiarity with SPC and JMP data analysis
Experience with efficiency problem solving techniques
Key Requirements
Understanding advanced package technology such as HBM/3Di