Package Design Engineer

Teledyne e2v Semiconductors SAS

Saint-Egrève, France
Experience in packaging design
Mastering package design flow
Knowledge in thermal simulations
Teledyne enables many of the products and services you use every day

Job Summary

  • Teledyne enables many of the products and services you use every day.
  • The Package Design Engineer leads the complete design flow of advanced microelectronic packages.
  • Join a company deeply committed to QHSE/CSR goals and work-life balance.

Matching Summary

Teledyne enables many of the products and services you use every day.

Skills & Requirements

Must-have

  • Experience in packaging design
  • Mastering package design flow
  • Knowledge in thermal simulations

Nice-to-have

  • Strong customer focus
  • Ability to adapt and communicate
  • Experience in imaging and assembly

Key Requirements

  • Background in microelectronics or electronics
  • First confirmed experience in packaging design
  • Good level of English and French

Work Rights

Not specified

Tailored Resume

Cover Letter