Principal Engineer, Process Engineering (Advanced Packaging)
ASM FRONT-END MANUFACTURING SINGAPORE PTE. LTD.
Singapore
Not specified
D2w/w2w hybrid bonding experience
Thin-film deposition expertise ald cvd pecvd
Materials characterization techniques xps sims
ASM Front-End Manufacturing Singapore is seeking a Principal Engineer in Process Engineering, specializing in advanced packaging. The ideal candidate will leverage their expertise in semiconductor processes to drive innovation and contribute to cutting-edge technologies in various applications
Job Summary
This role involves advancing ASM's semiconductor process technologies by developing innovative solutions for next-generation devices in logic, memory, and power applications.
The successful candidate will lead complex experiments using DOE and RSM methodologies to optimize processes for advanced packaging including W2W/D2W Hybrid bonding.
ASM offers a collaborative culture with over 55 years of innovation, supporting diversity, inclusion, and sustainability while providing growth programs for employee development.
Matching Summary
Match Score: 85
ASM Front-End Manufacturing Singapore is seeking a Principal Engineer in Process Engineering, specializing in advanced packaging. The ideal candidate will leverage their expertise in semiconductor processes to drive innovation and contribute to cutting-edge technologies in various applications.
Skills & Requirements
Must-have
D2W/W2W Hybrid bonding experience
Thin-film deposition expertise ALD CVD PECVD
Materials characterization techniques XPS SIMS
DOE and RSM experimental design methodologies
10 years combined education and work experience
Nice-to-have
Integration of CoWoS SoIC InFO flows
Strong communication skills for technical concepts
Mentorship and leadership capabilities
Intellectual property generation experience
Customer collaboration and requirement definition
Key Requirements
Bachelor's Master's or PhD in Chemical Engineering Materials Science Electrical Engineering or Physics
Minimum 10 years of experience in thin-film deposition and advanced packaging
Direct experience with D2W/W2W Hybrid bonding surface preparation steps