Senor Wire Bonding Manufacturing / Process Development Engineer

FLIR

Us, CA, United States
Base: $113,600.00-$151,400.00; bonus/equity: not s...
Automated wire bonding process expertise
Process capability and repeatability
Statistical analysis and doe
The engineer is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing

Job Summary

  • The engineer is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
  • This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
  • The engineer acts as a technical subject matter expert, providing hands-on support to operators and technicians while collaborating cross-functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.

Matching Summary

The engineer is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • automated wire bonding process expertise
  • process capability and repeatability
  • statistical analysis and DOE
  • equipment troubleshooting and maintenance
  • cross-functional collaboration
  • compliance with quality and reliability standards

Nice-to-have

  • experience in aerospace or defense manufacturing
  • knowledge of MIL-STD-883 and NASA standards
  • experience with MES systems
  • strong communication and training skills
  • lean manufacturing and continuous improvement mindset

Key Requirements

  • Bachelor’s degree in engineering or related field preferred
  • 3+ years experience in microelectronics manufacturing
  • Must be US Citizen or PERM Resident

Work Rights

Must have US citizenship or PERM residency

Tailored Resume

Cover Letter