Advanced Packaging Flagship Curriculum Internship Program
Intel
Kulim, Malaysia
On-site
Advanced packaging flagship curriculum completion
Undergraduate student status
Usm academic plan enrollment
Intel is offering an internship opportunity in advanced packaging technology manufacturing in Kulim, Malaysia, focused on students who have completed the Advanced Packaging Flagship Curriculum. The role involves supporting various assembly processes in semiconductor manufacturing while collaborating with engineering teams to optimize methodologies
Job Summary
This internship supports the development and implementation of assembly processes for specific modules in semiconductor manufacturing.
The role offers industrial exposure and technical skill enhancement through hands-on experience supporting Intel business goals.
Candidates must be undergraduate students enrolled in the Advanced Packaging Flagship Curriculum required by the USM academic plan.
Matching Summary
Match Score: 85
Intel is offering an internship opportunity in advanced packaging technology manufacturing in Kulim, Malaysia, focused on students who have completed the Advanced Packaging Flagship Curriculum. The role involves supporting various assembly processes in semiconductor manufacturing while collaborating with engineering teams to optimize methodologies.
Skills & Requirements
Must-have
Advanced Packaging Flagship Curriculum completion
Undergraduate student status
USM academic plan enrollment
Nice-to-have
Interest in package assembly processes
Experience with lasermark or inspection systems
Collaborative engineering environment skills
Key Requirements
Must be an undergraduate student
Completion of Advanced Packaging Flagship Curriculum