Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
Job Summary
Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company.
Matching Summary
Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
Salary
Base: $163,200.00 - $244,800.00; Bonus/Equity: Discretionary bonus; Benefits: Health Plan, Savings Plan, Paid Time Off, Education Assistance, Training and Development, 9/80 Work Schedule