Senior Packaging Technical Engineer - Hardware

NVIDIA

Remote
Base: 168,000 usd - 258,750 usd for level 4; 200,0...
Silicon pad ring design
Package layout design
Electrical package implementation
NVIDIA is at the forefront of AI technology, shaping the future of computing

Job Summary

  • NVIDIA is at the forefront of AI technology, shaping the future of computing.
  • You will define and implement chip pad rings and substrate interconnect schemes.
  • NVIDIA offers competitive salaries and a comprehensive benefits package.

Matching Summary

NVIDIA is at the forefront of AI technology, shaping the future of computing.

Salary

Base: 168,000 USD - 258,750 USD for Level 4; 200,000 USD - 322,000 USD for Level 5; Benefits: Not specified

Skills & Requirements

Must-have

  • Silicon pad ring design
  • Package layout design
  • Electrical package implementation

Nice-to-have

  • Innovative problem solvers
  • Collaborative team environment
  • Proactive ownership

Key Requirements

  • BSEE or equivalent experience
  • Minimum of 8+ years in board/system design
  • Experience with package design preferred

Work Rights

Not specified

Tailored Resume

Cover Letter