Job Summary

• The role involves driving improvements in wafer bonding and thinning performance while coordinating experiments for yield improvement.
• Candidates will support advanced package technology research including chip stacking and 2.5D/3D development efforts globally.
• The position requires troubleshooting complex process engineering issues through root cause analysis and generating technical documentation.

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Skills & Requirements

Key Requirements

• Master's degree or higher in Chemistry, Physics, Materials, or Engineering Science
• PhD is preferred but not required
• Must be fluent in both English and Chinese

Work Rights