Ic Technology Development - Wire Bond Process Sme

Tata Electronics

On-site
Wire bonding operations experience
Semiconductor manufacturing background
Team leadership and management
Tata Electronics is seeking a Lead for Wire Bonding operations within its semiconductor manufacturing facility. The role requires extensive experience in wire bonding, leadership abilities, and a strong background in semiconductor processes to enhance production quality and efficiency

Job Summary

  • The role involves leading wire bonding operations within India's first AI-enabled state-of-the-art Semiconductor Foundry.
  • Candidates must have extensive experience in wire bonding techniques and a proven track record of leadership in the semiconductor industry.
  • The position requires managing a diverse team, troubleshooting process issues, and ensuring compliance with strict quality standards.

Matching Summary

Match Score: 85

Tata Electronics is seeking a Lead for Wire Bonding operations within its semiconductor manufacturing facility. The role requires extensive experience in wire bonding, leadership abilities, and a strong background in semiconductor processes to enhance production quality and efficiency.

Skills & Requirements

Must-have

  • Wire bonding operations experience
  • Semiconductor manufacturing background
  • Team leadership and management
  • Process improvement implementation
  • Quality control enforcement

Nice-to-have

  • Collaborative work environment
  • Strategic planning skills
  • Cost savings identification
  • Continuous improvement mindset

Key Requirements

  • Bachelor's degree in Mechanical, Electronics or Electrical Engineering
  • Minimum 4+ years of experience in semiconductor manufacturing
  • Strong analytical and problem-solving skills

Work Rights

Not specified

Tailored Resume

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