Fab C4/bumping Module Engineer

Intel Corporation

Hillsboro, Oregon, US
Base: $120,860.00-231,670.00 usd; bonus/equity: st...
Hybrid
Equipment and process optimization
300mm toolsets
Thick metal/via layers
Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth

Job Summary

  • Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.
  • The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly, driving Intel's advanced packaging strategy.
  • We offer competitive salary and financial benefits as well as programs that promote health and well-being.

Matching Summary

Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.

Salary

Base: $120,860.00-231,670.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Equipment and process optimization
  • 300mm toolsets
  • Thick metal/via layers
  • Bumping, reflow, thinning
  • Backside metallization
  • Sustaining responsibilities
  • Excursion prevention and response

Nice-to-have

  • High-performing culture
  • Execution with urgency
  • Data-driven problem solving
  • Thrive in dynamic environments
  • Teamwork and leadership skills
  • Excellent communication skills

Key Requirements

  • Bachelor's Degree in STEM field
  • 6+ years semiconductor engineering experience
  • Knowledge of statistics and experimental design
  • Strong data analysis and presentation acumen
  • Strong technical and troubleshooting skills
  • Ability to work across organizational boundaries

Work Rights

Not specified

Tailored Resume

Cover Letter