The role involves top-down SoC floorplan activities including IP placement, partitioning, and pin-cutting to optimize latency and area
Job Summary
The role involves top-down SoC floorplan activities including IP placement, partitioning, and pin-cutting to optimize latency and area.
Candidates will collaborate with architects, clock design, and power delivery teams to define optimal physical dimensions and drive execution schedules.
Intel offers a competitive total compensation package including stock bonuses, health benefits, and a hybrid work model across multiple US locations.
Matching Summary
The role involves top-down SoC floorplan activities including IP placement, partitioning, and pin-cutting to optimize latency and area.