Senor Wire Bonding Manufacturing / Process Development Engineer

Teledyne Technologies Incorporated

Base: $113,600.00-$151,400.000; bonus/equity: not ...
Automated wire bonding processes
Process development and optimization
Statistical analysis and doe
Responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing

Job Summary

  • Responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
  • Acts as a technical subject matter expert, providing hands-on support to operators and technicians while collaborating cross-functionally.
  • Lead yield improvement projects and cycle-time reduction initiatives, driving process automation and digitalization.

Matching Summary

Responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.

Salary

Base: $113,600.00-$151,400.000; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Automated wire bonding processes
  • Process development and optimization
  • Statistical analysis and DOE
  • Hands-on wire bonder experience
  • Troubleshooting equipment and process issues

Nice-to-have

  • Thrive on making an impact
  • Excitement of being on a winning team
  • Continuous improvement mindset
  • Cross-functional collaboration skills

Key Requirements

  • 3+ years relevant experience
  • Bachelor's degree in Engineering or related field
  • US Citizen or PERM Resident

Work Rights

US Citizen or PERM Resident

Tailored Resume

Cover Letter