Senior Package Modeling Engineer

Topjobstoday

Base: 124,000 usd - 195,500 usd; bonus/equity: not...
Hybrid
5+ years of fea modeling experience
Strong expertise in fea tools
Knowledge of thermal-mechanical interactions
Join NVIDIA's Advanced Technology Group to drive innovation in computing

Job Summary

  • Join NVIDIA's Advanced Technology Group to drive innovation in computing.
  • Contribute to the reliability and performance of semiconductor packages.
  • Work in a diverse and ambitious environment with world-class talent.

Matching Summary

Join NVIDIA's Advanced Technology Group to drive innovation in computing.

Salary

Base: 124,000 USD - 195,500 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • 5+ years of FEA modeling experience
  • Strong expertise in FEA tools
  • Knowledge of thermal-mechanical interactions

Nice-to-have

  • Excellent problem-solving skills
  • Collaborative team environment
  • Mentorship and leadership abilities

Key Requirements

  • MS or PhD in Mechanical Engineering
  • Familiarity with JEDEC reliability standards
  • Practical understanding of advanced packaging architecture

Work Rights

Not specified

Tailored Resume

Cover Letter