半導体製造装置部門アプリケーションエンジニア(pcs)

Carl Zeiss Pty Ltd

Nagoya, Japan
Annual: ¥5,500,000 - ¥9,000,000; monthly: ¥340,000...
Sem imaging and fib-sem sample preparation
English communication for international clients
Customer technical support for fib-sem solutions
As a Field Application Engineer, you will be responsible for optimizing and validating 3D tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities

Job Summary

  • As a Field Application Engineer, you will be responsible for optimizing and validating 3D tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities.
  • You will act as the primary point of contact for customer interactions, coordinating meetings, technical review meetings, and technical discussions.
  • This role involves over 50% business travel to the US, South Korea, and Japan to visit customers and perform work.

Matching Summary

As a Field Application Engineer, you will be responsible for optimizing and validating 3D tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities.

Salary

Annual: ¥5,500,000 - ¥9,000,000; Monthly: ¥340,000 - ¥600,000; Bonus/Equity: Yes; Benefits: Yes

Skills & Requirements

Must-have

  • SEM imaging and FIB-SEM sample preparation
  • English communication for international clients
  • Customer technical support for FIB-SEM solutions
  • On-site customer visits and troubleshooting
  • Hardware and software development collaboration

Nice-to-have

  • Proactive problem-solving and leadership
  • Positive team atmosphere and interpersonal skills
  • Logical thinking and patience with unknown issues
  • Understanding of semiconductor industry workflows

Key Requirements

  • Practical experience with SEM imaging and FIB-SEM sample preparation
  • English communication skills (level capable of handling overseas customers and coordinating with HQ teams)
  • Valid driver's license

Work Rights

Not specified

Tailored Resume

Cover Letter