Internship: Electro/thermo Migration Reliability Capabilities Of Ic Packages

NXP Semiconductors

Nijmegen, Netherlands
Electro-migration
Thermo-migration
Ic package reliability
We are looking for a highly motivated student that will help us with developing new methods of testing and investigating the boundaries of the capabilities of IC packages related to thermo-migration and electro-migration

Job Summary

  • We are looking for a highly motivated student that will help us with developing new methods of testing and investigating the boundaries of the capabilities of IC packages related to thermo-migration and electro-migration.
  • This opportunity is within the Corporate Quality, NTI/NPI, & Reliability (CQNR) team. CQNR’s mission is to enable corporate quality & reliability capabilities to achieve NXP's business success.
  • A great opportunity to develop your skills (technical, soft skills, communication, etc.). Gaining experience in a multinational and diverse environment.

Matching Summary

We are looking for a highly motivated student that will help us with developing new methods of testing and investigating the boundaries of the capabilities of IC packages related to thermo-migration and electro-migration.

Skills & Requirements

Must-have

  • electro-migration
  • thermo-migration
  • IC package reliability
  • semiconductor physics

Nice-to-have

  • team player
  • international teams
  • multi-disciplinary teams
  • flexible and able to multi-task

Key Requirements

  • Master of Science in Microelectronics
  • Registered as a student during the entire period

Work Rights

Not specified

Tailored Resume

Cover Letter