Principal Product Engineer (adv Pkg Pathfinding), Heterogeneous Integration Group(hig), High Bandwidth Memory (hbm)

Micron Technology

United States
Not specified; not specified; benefits: medical, d...
Onsite with international travel to singapore and taiwan.
10+ years semiconductor industry experience
Advanced package process integration knowledge
Dram or memory product expertise
Micron Technology is seeking a Principal Product Engineer for their High Bandwidth Memory (HBM) division, responsible for leading a team in advanced package product engineering activities. The ideal candidate will possess extensive experience in the semiconductor industry, particularly in advanced packaging processes, and demonstrate strong collaborative and project management skills

Job Summary

  • The role involves leading a distributed team of professional Product Engineers managing a portfolio of outstanding Next Generation HBM products while driving strategic and tactical objectives.
  • Candidates will collaborate with Advanced Package Technology, Test Solutions, and Yield Engineering teams to enable sophisticated interconnect technology solutions including wafer-to-wafer bonding.
  • Micron offers a comprehensive benefits package including medical, dental, vision plans, paid family leave, and a robust paid time-off program designed to support personal wellbeing.

Matching Summary

Match Score: 85

Micron Technology is seeking a Principal Product Engineer for their High Bandwidth Memory (HBM) division, responsible for leading a team in advanced package product engineering activities. The ideal candidate will possess extensive experience in the semiconductor industry, particularly in advanced packaging processes, and demonstrate strong collaborative and project management skills.

Salary

Not specified; Not specified; Benefits: Medical, dental, vision, paid family leave, PTO

Skills & Requirements

Must-have

  • 10+ years semiconductor industry experience
  • Advanced package process integration knowledge
  • DRAM or memory product expertise
  • Electrical failure analysis skills
  • JMP data analysis tool proficiency
  • Team mentorship and development

Nice-to-have

  • Memory testing methodology familiarity
  • Flexible approach to dynamic roles
  • Strong collaborative cross-functional work
  • Project management skill development
  • Risk analysis decision making

Key Requirements

  • Bachelor's/Master's/Ph.D. in Engineering or related field
  • Minimum 10 years of semiconductor industry experience
  • Deep knowledge of advanced package process/integration
  • Work on site in US with international travel

Work Rights

Work on site in US required

Tailored Resume

Cover Letter