Metal-package Process Support Engineer

Applied Materials Inc

CheongJu, South Korea
3-7 years semiconductor fab experience
Electro plating process support
Pvd system troubleshooting
This role provides high-visibility technical support at customer sites to enable next-generation semiconductor packaging technologies

Job Summary

  • This role provides high-visibility technical support at customer sites to enable next-generation semiconductor packaging technologies.
  • The engineer will develop and optimize Metal-Package processes with a specific focus on Electro Plating and PVD systems.
  • Applied Materials offers a supportive work culture that encourages personal growth and innovation in materials science.

Matching Summary

This role provides high-visibility technical support at customer sites to enable next-generation semiconductor packaging technologies.

Skills & Requirements

Must-have

  • 3-7 years semiconductor fab experience
  • Electro Plating process support
  • PVD system troubleshooting
  • Design of Experiments (DOE) execution
  • Root cause analysis skills

Nice-to-have

  • Customer-facing technical support
  • Statistical data analysis proficiency
  • Mentoring junior engineers
  • Collaborative team environment

Key Requirements

  • Bachelor's degree in Materials Science or Engineering
  • 3-7 years experience in semiconductor equipment or fab
  • Strong English communication skills

Work Rights

Not specified

Tailored Resume

Cover Letter