The Senior TCB Application & Technical Sales Engineer position at The Supreme HR Advisory Pte. Ltd. involves engaging with semiconductor customers to address their packaging needs and technical sales support. Ideal candidates should possess significant experience in semiconductor packaging, particularly in TCB and advanced packaging applications
Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps, process requirements, and yield challenges.
Candidates will develop and optimize TCB process parameters while supporting advanced packaging applications like HBM and CoWoS.
The position requires leading machine qualification activities and collaborating with cross-functional teams including Mechanical and Software engineers.
Matching Summary
Match Score: 85
The Senior TCB Application & Technical Sales Engineer position at The Supreme HR Advisory Pte. Ltd. involves engaging with semiconductor customers to address their packaging needs and technical sales support. Ideal candidates should possess significant experience in semiconductor packaging, particularly in TCB and advanced packaging applications.
Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Advanced packaging applications knowledge
Troubleshooting bonding issues expertise
Nice-to-have
Fluxless or N2 bonding environment experience
OSAT or IDM industry background
Statistical analysis tools proficiency
Key Requirements
Bachelor's or Master's degree in Engineering or Materials Science
5-15 years of semiconductor packaging experience
Hands-on experience with TCB and Flip Chip processes