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The Senior TCB Application & Technical Sales Engineer position at THE SUPREME HR ADVISORY PTE. LTD. in Admiralty, Singapore, seeks a candidate with extensive experience in semiconductor packaging, particularly in Thermo Compression Bonding (TCB) and advanced packaging applications. The role involves supporting technical sales, engaging with customers, and optimizing TCB processes to meet client requirements.
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Job Summary
This role involves engaging semiconductor customers to understand packaging roadmaps and translate requirements into equipment specifications.
The engineer will develop and optimize TCB process parameters while supporting advanced packaging applications like HBM, CoWoS, and 3D Packaging.
Candidates must troubleshoot complex bonding issues including non-wet, misalignment, voids, delamination, and warpage using DOE methodologies.
Matching Summary
Match Score: 75
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The Senior TCB Application & Technical Sales Engineer position at THE SUPREME HR ADVISORY PTE. LTD. in Admiralty, Singapore, seeks a candidate with extensive experience in semiconductor packaging, particularly in Thermo Compression Bonding (TCB) and advanced packaging applications. The role involves supporting technical sales, engaging with customers, and optimizing TCB processes to meet client requirements.
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Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Advanced packaging applications (HBM, CoWoS)
Flip Chip process expertise
Troubleshooting bonding issues
DOE and process characterization
Nice-to-have
Fluxless or N2 bonding environment knowledge
OSAT or IDM industry background
Statistical analysis tools proficiency
Cross-functional team collaboration
Machine qualification leadership
Key Requirements
Bachelor's or Master's degree in Engineering or Materials Science
5-15 years of semiconductor packaging experience
Hands-on experience with TCB and Flip Chip processes