5+ years semiconductor process or equipment engineering experience
Wafer bonding and plating process knowledge
Warpage control and packaging field stacking expertise
The role focuses on developing and optimizing advanced packaging equipment to enable technology nodes for wafer-level packaging and stacking
Job Summary
The role focuses on developing and optimizing advanced packaging equipment to enable technology nodes for wafer-level packaging and stacking.
Candidates will lead the equipment team to collaborate with various departments including Package Integration, Front End Wafer Fab, and Global Quality.
The position requires establishing a 5+ year hardware strategic roadmap for post-probe wafer and die processing areas.
Matching Summary
Match Score: 85
The role focuses on developing and optimizing advanced packaging equipment to enable technology nodes for wafer-level packaging and stacking.
Salary
Not specified; Not specified; Not specified
Skills & Requirements
Must-have
5+ years semiconductor process or equipment engineering experience
Wafer bonding and plating process knowledge
Warpage control and packaging field stacking expertise
TC bonder or Hybrid Bonder proficiency
Fundamental understanding of semiconductor device physics
Nice-to-have
Proficiency in Python, R, SQL for data analytics
Experience with Visual Basic for automation
Familiarity with E3, FDC, and RMS systems
Strong SPC, DOE, and defect analysis capabilities
Knowledge of MES, ETO, and Autoshell systems
Key Requirements
B.S./M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields
Minimum 5 years of relevant semiconductor process or equipment engineering experience
Proven track record in solving root causes for First of a Kind (FOAK) hardware