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The job posting is for a Senior Process & Applications Engineer & Presales Engineer at The Supreme HR Advisory Pte. Ltd., located in Singapore, offering a competitive monthly salary of SGD 7,000 – SGD 10,000. The role involves engaging with semiconductor customers to address packaging challenges and supporting technical sales activities.
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Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps and technical requirements while supporting sales activities.
Candidates will be responsible for developing TCB process parameters, troubleshooting complex bonding issues, and leading machine qualification activities.
This position requires close collaboration with mechanical, software, electrical, motion, and vision teams to define alignment accuracy and thermal performance.
Matching Summary
Match Score: 75
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The job posting is for a Senior Process & Applications Engineer & Presales Engineer at The Supreme HR Advisory Pte. Ltd., located in Singapore, offering a competitive monthly salary of SGD 7,000 – SGD 10,000. The role involves engaging with semiconductor customers to address packaging challenges and supporting technical sales activities.
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Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Advanced packaging applications knowledge
Troubleshooting bonding issues expertise
DOE and process characterization skills
Machine qualification and FAT/SAT support
Nice-to-have
Fluxless or N2 bonding environment experience
OSAT, IDM or equipment environment background
HBM / CoWoS / 2.5D / 3D packaging exposure
Strong statistical analysis tool proficiency
Cross-functional team collaboration ability
Key Requirements
Bachelor's or Master's degree in Engineering or Materials Science
5–15 years of semiconductor packaging experience
Hands-on experience in TCB and Flip Chip processes