Senior Program Manager

Intel Retiree Medical Plan Trust

Tokyo, Japan
Onsite
Advanced packaging substrate technology
Supplier capacity qualification
Process control system adherence
Work at the forefront of packaging technologies essential for next-generation AI devices

Job Summary

  • Work at the forefront of packaging technologies essential for next-generation AI devices.
  • Collaborate with substrate suppliers worldwide to drive innovation and scalability.
  • Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand.

Matching Summary

Work at the forefront of packaging technologies essential for next-generation AI devices.

Skills & Requirements

Must-have

  • advanced packaging substrate technology
  • supplier capacity qualification
  • process control system adherence
  • new factory startup micro-schedules
  • production ramp-up monitoring

Nice-to-have

  • solving complex challenges
  • challenging conventional approaches
  • building lasting supplier partnerships
  • thrive on innovation
  • situational leadership

Key Requirements

  • Bachelor's or Master's degree with 8+ years, or PhD with 4+ years work experience, in Science or Engineering
  • 6+ years of experience in fab back-end or substrate manufacturing process development
  • Experience in capacity management
  • Experience in lead time analysis
  • Experience in yield improvement
  • Experience in structured problem solving
  • Experience in supplier influence
  • Experience in stakeholder management
  • Fluent business-level English communication skills

Work Rights

Not specified

Tailored Resume

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