Senior Metals Deposition Engineer

Intel

Hillsboro, Oregon, United States
Base: $155,520.00-298,440.00 usd; bonus/equity: st...
Hybrid
7+ years semiconductor manufacturing experience
4+ years direct metals deposition module experience
Hands-on pvd, cvd, or ald technology experience
This strategic role bridges Technology Development, High Volume Manufacturing, and Customer Engineering to ensure seamless module readiness from early development through full production ramp

Job Summary

  • This strategic role bridges Technology Development, High Volume Manufacturing, and Customer Engineering to ensure seamless module readiness from early development through full production ramp.
  • The position requires owning the resolution of complex technical challenges while collaborating effectively with internal teams including Integration, Device, Yield, Defect Metrology, Quality, and Reliability.
  • Intel offers a competitive compensation package including stock bonuses, health benefits, retirement plans, and vacation time for this hybrid work model role.

Matching Summary

This strategic role bridges Technology Development, High Volume Manufacturing, and Customer Engineering to ensure seamless module readiness from early development through full production ramp.

Salary

Base: $155,520.00-298,440.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • 7+ years semiconductor manufacturing experience
  • 4+ years direct metals deposition module experience
  • Hands-on PVD, CVD, or ALD technology experience
  • Master's degree in engineering or science field
  • Process development and HVM transfer experience

Nice-to-have

  • Doctoral degree in relevant engineering field
  • Experience with advanced technology nodes below 10nm
  • Supplier collaboration for hardware and chemistry improvements
  • Cross-functional leadership in yield improvement task forces
  • Integration experience with CMP, lithography, and etch processes

Key Requirements

  • Master's degree in Chemical, Materials, Electrical, Mechanical Engineering, Physics, or related field
  • 7+ years of semiconductor manufacturing or process development experience
  • 4+ years of direct experience with metals deposition modules
  • Previous semiconductor foundry experience preferred
  • Experience with advanced technology nodes (10nm and below)

Work Rights

Not specified

Tailored Resume

Cover Letter