Package Design Rule Owner (dro)

Intel Corporation

Phoenix, Arizona, United States
$141,910.00-269,100.00 usd; not specified; health,...
Hybrid
Package substrate design rules
Technology and product concept
Cross-disciplinary stakeholders
The Package Substrate Design Rule Owner (DRO) is responsible for definition, validation and deployment of design rules for package substrate design

Job Summary

  • The Package Substrate Design Rule Owner (DRO) is responsible for definition, validation and deployment of design rules for package substrate design.
  • This position involves working with cross-disciplinary and cross-organizational stakeholders and interfacing directly with product designers.
  • We offer a total compensation package that ranks among the best in the industry.

Matching Summary

The Package Substrate Design Rule Owner (DRO) is responsible for definition, validation and deployment of design rules for package substrate design.

Salary

$141,910.00-269,100.00 USD; Not specified; health, retirement, and vacation

Skills & Requirements

Must-have

  • package substrate design rules
  • technology and product concept
  • cross-disciplinary stakeholders
  • product designers
  • external suppliers and customers

Nice-to-have

  • advanced packaging architectures
  • analytical and problem-solving skills
  • work independently and at various levels
  • strong organization and time management
  • IC Packaging understanding

Key Requirements

  • US Citizenship is required
  • Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph
  • Bachelor's degree in STEM
  • 6+ years of experience with a Bachelor's degree
  • 2+ years in semiconductor fabrication processes
  • 2+ years in package substrate physical design

Work Rights

US Citizenship and TS/SCI Clearance with Polygraph

Tailored Resume

Cover Letter