Die Attach Equipment Technician

NXP USA INC.

Kuala Lumpur, Malaysia
On-site
Die attach integrated line maintenance
Troubleshoot and repair equipment
Datacon 8800 fc quantum experience
NXP USA INC. is seeking a skilled Die Attach Equipment Technician in Kuala Lumpur, Malaysia, who can independently maintain and troubleshoot semiconductor assembly equipment. The ideal candidate should have substantial experience with Die Attach equipment and a strong background in electrical or mechanical engineering

Job Summary

  • Experience Die Attach Equipment Technician capable to work independently to maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
  • Maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
  • Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness and Unscheduled Downtime.

Matching Summary

Match Score: 85

NXP USA INC. is seeking a skilled Die Attach Equipment Technician in Kuala Lumpur, Malaysia, who can independently maintain and troubleshoot semiconductor assembly equipment. The ideal candidate should have substantial experience with Die Attach equipment and a strong background in electrical or mechanical engineering.

Skills & Requirements

Must-have

  • Die Attach integrated line maintenance
  • Troubleshoot and repair equipment
  • Datacon 8800 FC QUANTUM experience
  • Meet department OEE and MTBA/MTBF goals
  • Identify and sustain critical spare parts

Nice-to-have

  • Applied statistics knowledge
  • Good discipline and tardiness
  • NXP Total Quality Mindset
  • NXP core value adherence

Key Requirements

  • Diploma in Electrical & Electronics or Mechanical Engineering
  • Min 5 years' relevant experience
  • Experience in semiconductor assembly
  • Good technical skills on Front and Back End assembly equipment
  • Must be willing to work long hours and shifts

Work Rights

Not specified

Tailored Resume

Cover Letter