Module Development Engineer- Hybrid Bonding

Intel Corporation

Hillsboro, Oregon, United States
Base: $99,030.00-139,810.00 usd annually; bonus/eq...
Onsite
Ms degree in engineering or stem field
Experience with fab processes and data analysis
Knowledge of statistical process control and fmea
The role involves owning execution of maintenance and repair activities while driving continuous improvement for equipment and process performance

Job Summary

  • The role involves owning execution of maintenance and repair activities while driving continuous improvement for equipment and process performance.
  • Candidates will lead the integration of new technologies and ensure seamless transitions during factory ramps and new product introductions.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, retirement plans, and relocation assistance.

Matching Summary

The role involves owning execution of maintenance and repair activities while driving continuous improvement for equipment and process performance.

Salary

Base: $99,030.00-139,810.00 USD annually; Bonus/Equity: Stock and bonuses included; Benefits: Health, retirement, and vacation provided

Skills & Requirements

Must-have

  • MS Degree in Engineering or STEM field
  • Experience with fab processes and data analysis
  • Knowledge of statistical process control and FMEA
  • Proficiency in Excel JMP SQL MATLAB SOLIDWORKS Python
  • Ability to work onsite in Hillsboro Oregon

Nice-to-have

  • Prior experience in semiconductor industry
  • Eagerness to learn in fast-paced environment
  • Strong analytical and problem-solving skills
  • Excellent communication and teamwork abilities

Key Requirements

  • Master's degree in Mechanical Electrical Chemical or Computer Engineering
  • Up to 2 years of relevant experience preferred
  • Onsite presence required at Ronler Acres facilities

Work Rights

Not specified

Tailored Resume

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