Silicon MEMS Fab Process Development Engineer (Coat/Develop)
HP SINGAPORE (PRIVATE) LIMITED
Singapore
Not specified (assumed to be onsite in singapore based on job location)
3 years semiconductor wafer fab experience
Photo polymer and photo resist process knowledge
Doe study and process characterization skills
HP Singapore is seeking a Silicon MEMS Fab Process Development Engineer to lead the development of photo polymer and resist coat processes, ensuring their manufacturability and stability. The ideal candidate will have a background in semiconductor processes, project management skills, and strong analytical abilities
Job Summary
The role involves developing new photo polymer and photo resist coat processes while ramping them up to manufacturing stability.
Candidates will lead the transfer of new technology and processes from the US development team to the Singapore facility.
Success in this position requires defining stable manufacturable process steps through Design of Experiments (DOE) studies.
Matching Summary
Match Score: 85
HP Singapore is seeking a Silicon MEMS Fab Process Development Engineer to lead the development of photo polymer and resist coat processes, ensuring their manufacturability and stability. The ideal candidate will have a background in semiconductor processes, project management skills, and strong analytical abilities.
Skills & Requirements
Must-have
3 years semiconductor wafer fab experience
Photo polymer and photo resist process knowledge
DOE study and process characterization skills
Cleanroom work environment capability
Cross-functional team collaboration
Nice-to-have
Advanced project management skills
Strong negotiation and influencing abilities
Experience with new tooling down selection
Knowledge of latest industry technologies
Ability to work under tight timelines
Key Requirements
Bachelor's or Master's degree in Engineering
Minimum 3 years in semiconductor wafer fab
In-depth knowledge of semiconductor process engineering