Senior Wet Etch Manufacturing Development Engineer

Intel

Hillsboro, Oregon, United States
Base: $155,520.00-298,440.00 usd; bonus/equity: st...
Hybrid
7+ years semiconductor manufacturing experience
Design of experiments doe expertise
Root cause analysis capabilities
This role bridges the gap between breakthrough technology development and high-volume manufacturing within Intel's MDCE organization

Job Summary

  • This role bridges the gap between breakthrough technology development and high-volume manufacturing within Intel's MDCE organization.
  • You will drive advanced process development including parameter optimization, material selection, and system design to exceed functional requirements.
  • The position offers a competitive compensation package ranging from $155,520.00 to $298,440.00 USD annually with stock bonuses and comprehensive benefits.

Matching Summary

This role bridges the gap between breakthrough technology development and high-volume manufacturing within Intel's MDCE organization.

Salary

Base: $155,520.00-298,440.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • 7+ years semiconductor manufacturing experience
  • Design of Experiments DOE expertise
  • Root cause analysis capabilities
  • Module integration across etch deposition CMP lithography
  • Process optimization and defect reduction
  • Bachelor's degree in STEM field

Nice-to-have

  • Post graduate degree in engineering or science
  • Experience with sub-10nm logic nodes
  • Collaboration with equipment and materials suppliers
  • Cross-functional leadership experience
  • Mentoring junior engineers
  • Strong ownership mindset

Key Requirements

  • Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science, Physics, or Mechanical Engineering
  • 7+ years of semiconductor manufacturing or process development experience
  • 1+ years of Design of Experiments (DOE) and statistical process control experience
  • 2+ years of root-cause analysis using structured problem-solving
  • 2+ years of module integration experience across etch, deposition, CMP, or lithography

Work Rights

Not specified

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