Failure Analysis (fa) Engineer

NXP Semiconductors

Kuala Lumpur, Malaysia
On-site
Interpret test data
Bench-level testing verification
Product analysis processes
NXP Semiconductors is seeking a Failure Analysis Engineer in Kuala Lumpur, Malaysia, to investigate and identify failure mechanisms in semiconductor devices. The role requires collaboration with various teams and involves hands-on testing and analysis using advanced tools

Job Summary

  • A Failure Analysis (FA) Engineer must be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem.
  • The successful candidate will reproduce electrical failures in a lab environment and locate/characterize the defect or anomaly using a variety of electrical, optical, and physical techniques.
  • Analysis techniques will involve a range of approaches including: rigorous analysis of the device on evaluation boards (EVBs), detailed in-circuit probing to examine signal behavior & de-processing of the packaged device in order to identify the cause of failure.

Matching Summary

Match Score: 85

NXP Semiconductors is seeking a Failure Analysis Engineer in Kuala Lumpur, Malaysia, to investigate and identify failure mechanisms in semiconductor devices. The role requires collaboration with various teams and involves hands-on testing and analysis using advanced tools.

Skills & Requirements

Must-have

  • interpret test data
  • bench-level testing verification
  • product analysis processes
  • determine failure mechanism
  • reproduce electrical failures
  • locate/characterize defect
  • electrical, optical, physical techniques
  • collaboration with experts
  • document failure analysis reports
  • rigorous analysis on evaluation boards
  • in-circuit probing
  • de-processing of packaged device
  • Focused Ion Beam (FIB)
  • Scanning Electron Microscopy (SEM)
  • EMMI and Laser Induced Electrical Stimulation tools
  • OBIRCH tools

Nice-to-have

  • laboratory environment experience
  • wafer fab experience
  • manufacturing environment experience
  • microprobe measurement
  • test measurement knowledge
  • fault isolation techniques
  • FA process flow knowledge
  • analysis techniques knowledge

Key Requirements

  • Degree/Masters in Microelectronics, Material Science, Physics or equivalent
  • Good technical knowledge of digital and analog circuit fundamentals
  • Understanding of semiconductor device physics and behavior
  • Understanding of semiconductor packaging processing
  • Teamwork, problem solving, project management skills
  • Able to work in dynamic environment
  • Knowledge of common computer software packages
  • Ability to work with chemicals, X-Ray, Electron and Ion Beam Tools

Work Rights

Not specified

Tailored Resume

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