Package Design Rule Owner (dro)

Intel Foundry

Phoenix, Arizona, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: st...
Hybrid
Package substrate design rule owner
Semiconductor fabrication processes
Package substrate physical design
The role involves defining and deploying design rules for package substrates from early technology concepts through product tape out

Job Summary

  • The role involves defining and deploying design rules for package substrates from early technology concepts through product tape out.
  • Candidates must possess US citizenship and the ability to obtain a TS/SCI Security Clearance with Polygraph.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

The role involves defining and deploying design rules for package substrates from early technology concepts through product tape out.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • Package Substrate Design Rule Owner
  • Semiconductor fabrication processes
  • Package substrate physical design
  • Cross-organizational stakeholder collaboration

Nice-to-have

  • Advanced packaging architectures expertise
  • Strong analytical and problem-solving skills
  • Ability to work independently at various levels
  • Creative solutions for debugging issues

Key Requirements

  • US Citizenship required
  • TS/SCI Security Clearance with Polygraph
  • Bachelor's degree in STEM field
  • 6+ years experience with Bachelor's or 2+ with PhD
  • 2+ years in semiconductor packaging technologies

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter