Staff Etch Process Engineer

Qorvo Inc

Hillsboro, OR, US
On-site
Plasma etch process ownership
Plasma etch fundamentals
Rie and icp etch platforms
The candidate will be a key member of the plasma etch team tasked with driving technical solutions and enabling next‑generation plasma etch platforms for RF GaAs based integrated circuits

Job Summary

  • The candidate will be a key member of the plasma etch team tasked with driving technical solutions and enabling next‑generation plasma etch platforms for RF GaAs based integrated circuits.
  • Responsibilities include process ownership of plasma etch modules, leading technology transitions to newer etch platforms, and ensuring robust integration with upstream and downstream process modules.
  • The role requires close collaboration with cross‑functional groups to ensure manufacturable processes that meet quality, yield, and reliability requirements.

Matching Summary

The candidate will be a key member of the plasma etch team tasked with driving technical solutions and enabling next‑generation plasma etch platforms for RF GaAs based integrated circuits.

Skills & Requirements

Must-have

  • plasma etch process ownership
  • plasma etch fundamentals
  • RIE and ICP etch platforms
  • structured problem-solving approach
  • data analysis and SPC

Nice-to-have

  • customer-oriented mindset
  • tolerance for ambiguity
  • self-directed assignments
  • highly dynamic environment

Key Requirements

  • PhD, Masters, or Bachelors degree
  • 3+ years plasma etch experience (PhD)
  • 6+ years plasma etch experience (MS)
  • 8+ years plasma etch experience (BS)
  • greater than 5 years process ownership experience

Work Rights

Not specified

Tailored Resume

Cover Letter