Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly
Job Summary
Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
Own molding process performance, yield, and equipment stability in production, providing technical leadership within cross-functional teams.
Drive continuous improvement initiatives to enhance yield, quality, reliability, UPH, and cost efficiency while identifying and mitigating integration risks.
Matching Summary
Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
Skills & Requirements
Must-have
molding processes and equipment
semiconductor backend assembly
process robustness and equipment performance
yield improvement and technology readiness
troubleshoot molding-related issues
molding compound selection and evaluation
Nice-to-have
customer-focused with ownership mindset
influence without authority
perform effectively in fast-paced environment
Key Requirements
Bachelor’s degree in Engineering or technical discipline
Minimum 5 years semiconductor manufacturing experience
Strong understanding of backend assembly molding processes