About Rain Tree Photonics At Rain Tree Photonics, we are building next-generation optical engines for co-packaged optics (CPO) and near-packaged optics (NPO) to break the bandwidth and power bottlenecks in AI infrastructure. Our silicon photonic ICs power 200G/lane and beyond interconnects, enabling scalable, energy-efficient connectivity for AI data centers. Role Overview You will design high-speed silicon photonic integrated circuits operating at the limits of bandwidth and integration, and take them from concept → tapeout → silicon validation. This role is suitable for strong PhD graduates through early-career engineers (~0–5 years experience) who want to work on real, production-bound systems, not just simulations. Roles & Responsibilities Design and optimize silicon photonic devices and circuits, including: o High-speed modulators (MZI, ring, advanced structures) o Photodetectors and receiver building blocks o Passive components (couplers, filters, routing) Perform multi-domain simulations (EM, circuit, thermal) to meet targets in: o Bandwidth (200G/lane+) o Insertion loss, extinction ratio, efficiency Implement PIC layouts (GDS) using foundry PDKs and support tapeouts Co-design with electronics and packaging teams for CPO/NPO systems: o RF effects, parasitics, signal integrity, and thermal constraints Support silicon bring-up and characterization: o Correlate measurement vs simulation o Drive design iterations and improvements Contribute to design libraries, modeling, and methodology development Requirements Education PhD in Electrical Engineering, Physics, or related field (silicon photonics or closely related area) Experience 0–5 years of relevant experience (including fresh PhD graduates) Technical Skills Experience in design and simulation of silicon photonic devices or PICs Strong understanding of guided-wave optics and device physics Familiarity with tools such as Lumerical, COMSOL, or equivalent Implementation Skills Exposure to PIC layout and tapeout f