Analog Devices, Inc. is seeking an Engineer for Process Development Engineering in the Philippines, focusing on optimizing semiconductor packaging processes. The ideal candidate will have experience with Die Attach and Flip Chip assembly, as well as a strong problem-solving skillset to support production lines
Job Summary
The role involves developing, qualifying, and optimizing Die Attach and Flip Chip assembly processes for semiconductor packaging.
Candidates will provide engineering support for production lines by troubleshooting yield and quality issues while performing process characterization.
The position requires supporting new product introduction and driving continuous improvement to enhance yield, productivity, and cycle time.
Matching Summary
Match Score: 85
Analog Devices, Inc. is seeking an Engineer for Process Development Engineering in the Philippines, focusing on optimizing semiconductor packaging processes. The ideal candidate will have experience with Die Attach and Flip Chip assembly, as well as a strong problem-solving skillset to support production lines.
Skills & Requirements
Must-have
Die Attach process development
Flip Chip assembly experience
DOE and process optimization
Yield troubleshooting skills
NPI and process transfer support
Nice-to-have
Advanced packaging technologies knowledge
Cross-functional communication skills
Continuous improvement initiatives
Key Requirements
Bachelor's or Master's degree in Engineering
3-10 years in semiconductor packaging manufacturing