Deliver practical and theoretical training on IC manufacturing processes such as wafer handling, die attach, wire bonding, encapsulation, and electrical testing
Job Summary
Deliver practical and theoretical training on IC manufacturing processes such as wafer handling, die attach, wire bonding, encapsulation, and electrical testing.
Instruct trainees on cleanroom protocols, ESD control, contamination control, safety practices, and basic machine troubleshooting.
Prepare trainees for OSAT / NSQF-aligned skill assessments and ensure compliance with quality systems like SPC and SOPs.
Matching Summary
Deliver practical and theoretical training on IC manufacturing processes such as wafer handling, die attach, wire bonding, encapsulation, and electrical testing.
Skills & Requirements
Must-have
IC manufacturing processes
Semiconductor equipment operation
Cleanroom protocols
ESD control
Process flow demonstration
Hands-on labs and simulations
Nice-to-have
Strong discipline and safety-first mindset
Patience and ability to train
Willingness to upgrade skills
Basic orientation on industry expectations
Key Requirements
ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology
1–5 years of hands-on experience in IC manufacturing
OSAT / NSQF / Semiconductor Skill Certification preferred
Experience in cleanroom or ESD-controlled environments is highly desirable
Training or mentoring experience is an added advantage