The Senior TCB Application & Technical Sales Engineer position at The Supreme HR Advisory involves engaging with semiconductor customers to address packaging requirements and support technical sales activities. Candidates should have substantial experience in semiconductor packaging, particularly with TCB and advanced packaging processes. The role is based in Singapore and offers a competitive salary based on experience
Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps and translate requirements into internal equipment specifications.
Candidates will lead machine qualification activities including FAT and SAT while supporting advanced packaging applications like HBM and CoWoS.
The position requires troubleshooting complex bonding issues such as misalignment, warpage, and non-wet defects using DOE and process characterization.
Matching Summary
Match Score: 85
The Senior TCB Application & Technical Sales Engineer position at The Supreme HR Advisory involves engaging with semiconductor customers to address packaging requirements and support technical sales activities. Candidates should have substantial experience in semiconductor packaging, particularly with TCB and advanced packaging processes. The role is based in Singapore and offers a competitive salary based on experience.
Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Flip Chip and Advanced Packaging knowledge
HBM, CoWoS, 2.5D, 3D packaging expertise
Troubleshooting bonding issues like voids and delamination
DOE and process characterization skills
Machine qualification FAT and SAT activities
Nice-to-have
Fluxless or N2 bonding environment experience
Experience in OSAT or IDM environments
Strong understanding of thermal management
Vision systems and alignment accuracy knowledge
Statistical analysis tools proficiency
Key Requirements
Bachelor's or Master's Degree in Engineering or Materials Science
5–15 years of semiconductor packaging experience
Hands-on experience with TCB and Flip Chip processes