【2026 TSMC Campus Recruitment】Integrated Interconnect & Packaging Engineer (IIP)

Taiwan Semiconductor Manufacturing Company Limited

Taipei, Taiwan
On-site
Master's degree in engineering or science
Experience with 3dic process development
Knowledge of info cowos coupe soic technologies
Taiwan Semiconductor Manufacturing Company (TSMC) is seeking an Integrated Interconnect & Packaging Engineer to join their IIP team in Taipei. The role involves developing advanced 3DIC processes and optimizing package structures, requiring a master's degree in engineering or science and strong problem-solving skills

Job Summary

  • You will initiate novel package concepts and drive advanced package development for TSMC's customers.
  • The role involves developing 3DIC processes such as InFO, CoWoS, Coupe, and SoIC while ensuring reliability and failure mode analysis.
  • TSMC fosters a global inclusive workplace where every employee can bring unique perspectives to drive innovation.

Matching Summary

Match Score: 85

Taiwan Semiconductor Manufacturing Company (TSMC) is seeking an Integrated Interconnect & Packaging Engineer to join their IIP team in Taipei. The role involves developing advanced 3DIC processes and optimizing package structures, requiring a master's degree in engineering or science and strong problem-solving skills.

Skills & Requirements

Must-have

  • Master's degree in engineering or science
  • Experience with 3DIC process development
  • Knowledge of InFO CoWoS Coupe SoIC technologies
  • Proficiency in FEM software like Ansys LS-DYNA Abaqus
  • Strong technical problem-solving skills

Nice-to-have

  • Experience in TV design or IC packaging
  • Good communication skills in Chinese and English
  • Hands-on participation and strong sense of ownership
  • Process improvement on 3DIC package structures

Key Requirements

  • Master's degree or above in Chemical Engineering Material Science Chemistry Physics Mechanical Engineering
  • Mastery of FEM software for simulation positions
  • Fluency in Chinese and English communication

Work Rights

Not specified

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