Fab Module Engineer

Intel

Hillsboro, Oregon, US
Base: $76,390.00-107,840.00 usd; bonus/equity: sto...
Hybrid
Equipment and process optimization
Factory 300mm toolsets
Thick metal/via layers
Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth

Job Summary

  • Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.
  • The Wafer Packaging Manufacturing (WPM) organization drives Intel's advanced packaging strategy, bringing compelling capabilities to market and enabling large-scale AI computing.
  • We offer competitive salary and financial benefits as well as programs that promote health and well-being.

Matching Summary

Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.

Salary

Base: $76,390.00-107,840.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Equipment and process optimization
  • Factory 300mm toolsets
  • Thick metal/via layers
  • Bumping, reflow, thinning
  • Backside metallization
  • Sustaining responsibilities
  • Excursion prevention and response

Nice-to-have

  • High-performing culture
  • Execution with urgency
  • Personal ownership
  • Data-driven problem solving
  • Thrive in dynamic environments
  • Teamwork and leadership skills
  • Communication and influencing skills

Key Requirements

  • Bachelor's Degree in Engineering STEM
  • Knowledge of statistics
  • Experimental design skills
  • Strong data analysis acumen
  • Technical and troubleshooting skills
  • Ability to work across organizational boundaries
  • Excellent teamwork and leadership skills

Work Rights

Not specified

Tailored Resume

Cover Letter