This role involves leading the development of Intel's advanced chip packaging process technology within the MIHL module engineering team
Job Summary
This role involves leading the development of Intel's advanced chip packaging process technology within the MIHL module engineering team.
The engineer will establish metrology and defect inspection capabilities to accelerate process development and ensure effective outgoing quality screening.
Responsibilities include developing inspection process recipes, engaging with product design for FMEA, and optimizing next-generation machine learning models.
Matching Summary
This role involves leading the development of Intel's advanced chip packaging process technology within the MIHL module engineering team.
Skills & Requirements
Must-have
Bachelor's or Master's degree in Engineering
Fundamental physical processes troubleshooting
Optics fundamentals applied to imaging techniques
Statistical process control SPC and DOE
High volume manufacturing process development
Nice-to-have
Machine Learning model development experience
Python data science tools proficiency
OpenCV and CNN Image Classification skills
Dimensional management for package features
Data management and visualization experience
Key Requirements
Minimum Bachelor's or Master's degree in STEM field
Experience with optical, laser, motion, or electrical systems
Understanding of light-matter interaction principles