Senior Technical Sales & Applications Engineer – Advanced Packaging (TCB / HBM / CoWoS) | 5 days/ $10k [0580]

THE SUPREME HR ADVISORY PTE. LTD.

Singapore, Singapore
Base: sgd 7,000 – sgd 10,000pmnth; bonus/equity: n...
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Thermo compression bonding (tcb) process expertise
Hbm, cowos, 2.5d, and 3d packaging experience
Flip chip bonding and alignment troubleshooting
** The job posting is for a Senior Technical Sales & Applications Engineer specializing in Advanced Packaging technologies at The Supreme HR Advisory Pte. Ltd. in Singapore. The role requires extensive experience in semiconductor packaging processes, particularly in TCB and advanced packaging, along with strong technical sales support skills. **

Job Summary

  • The role involves engaging semiconductor customers to define packaging roadmaps and resolve yield challenges.
  • Candidates will lead machine qualification activities including FAT and SAT while optimizing TCB process parameters.
  • The position requires translating customer requirements into internal specifications for advanced packaging technologies like HBM and CoWoS.

Matching Summary

Match Score: 75

** The job posting is for a Senior Technical Sales & Applications Engineer specializing in Advanced Packaging technologies at The Supreme HR Advisory Pte. Ltd. in Singapore. The role requires extensive experience in semiconductor packaging processes, particularly in TCB and advanced packaging, along with strong technical sales support skills. **

Salary

Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Thermo Compression Bonding (TCB) process expertise
  • HBM, CoWoS, 2.5D, and 3D packaging experience
  • Flip Chip bonding and alignment troubleshooting
  • DOE and statistical analysis for yield optimization
  • Machine qualification FAT and SAT activities

Nice-to-have

  • Fluxless or N2 bonding environment knowledge
  • Experience in OSAT or IDM environments
  • Cross-functional collaboration with vision teams
  • Competitor equipment benchmarking skills

Key Requirements

  • Bachelor's or Master's degree in Engineering or Materials Science
  • 5-15 years of semiconductor packaging experience
  • Hands-on experience with TCB and Flip Chip processes

Work Rights

Not specified

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