Packaging Engineer - High Voltage

Unknown Tech Company 1

Hiji, Oita Prefecture, Japan
Not specified (assumed to be in-office based on location)
High voltage (200-3300v) packages
High power modules
Gan, sic, igbt technologies
Texas Instruments is seeking a Packaging Engineer for high voltage applications in Hiji, Japan. The role requires extensive experience in semiconductor packaging, particularly with high voltage and high power modules, along with strong leadership and collaboration skills

Job Summary

  • The Emerging Packaging and Test Team is looking for a candidate to lead a high-performing team to define, design, develop, and scale high voltage (200-3300V) packages and high power modules for Industrial, Automotive, Renewable, and Telecom markets.
  • The candidate must understand market trends and end equipment system requirements, define solutions across various HV technologies, and validate them using simulation tools.
  • The role involves identifying prototype/subcon partners, assessing manufacturing capabilities, driving first article builds, developing new process flows, outlining reliability plans, and managing material suppliers.

Matching Summary

Match Score: 85

Texas Instruments is seeking a Packaging Engineer for high voltage applications in Hiji, Japan. The role requires extensive experience in semiconductor packaging, particularly with high voltage and high power modules, along with strong leadership and collaboration skills.

Skills & Requirements

Must-have

  • High voltage (200-3300V) packages
  • High power modules
  • GaN, SiC, IGBT technologies
  • CFD, thermomechanical, electrical parasitic extraction
  • Material supplier landscape
  • Process/equipment integration

Nice-to-have

  • Market trends and end equipment system requirements
  • Collaborative cross-functional teams
  • Accelerating development cycles
  • Rapid time-to-market

Key Requirements

  • BS degree in Mechanical, Material Sciences, Electrical Engineering or related
  • 10+ years of experience in High Voltage and high power semiconductor packaging
  • Hands-on high voltage package and power module design
  • Prior experience scaling HV packages to high volume manufacturing
  • Strong knowledge of Silicon / GaN / SiC-package interaction
  • Proficiency in English and Japanese

Work Rights

Not specified

Tailored Resume

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