At Teledyne MEMS, we’re shaping the future of microelectromechanical systems that power everything from biomedical breakthroughs to space exploration and AI innovation
Job Summary
At Teledyne MEMS, we’re shaping the future of microelectromechanical systems that power everything from biomedical breakthroughs to space exploration and AI innovation.
The Integration Engineer/Scientist III is responsible for the technical success of projects from design to delivery, including leading development projects and applying advanced statistical methods for process improvement.
We offer a collaborative, inclusive team environment with opportunities for growth, competitive compensation and benefits, and the chance to work on technologies impacting space, healthcare, and AI.
Matching Summary
At Teledyne MEMS, we’re shaping the future of microelectromechanical systems that power everything from biomedical breakthroughs to space exploration and AI innovation.
Skills & Requirements
Must-have
MEMS fabrication process development
Advanced Design of Experiments (DoE)
Process capability and SPC analysis
Technical project leadership
Structured problem-solving methods
Process documentation and control plans
Nice-to-have
MEMS design or layout experience
Statistical analysis skills
Cross-functional collaboration
Coaching and team development
Technical writing and presentation
Adaptability and curiosity
Key Requirements
Bachelor’s Degree in Engineering, Chemistry, or Physics
Five years MEMS or semiconductor fabrication experience