$180,000.00 - $247,500.00; not specified; not spec...
Hybrid
Heterogenous integration
Advanced packaging
W2w/d2w bonding
Applied Materials is a global leader in materials engineering solutions for new chip and advanced display production
Job Summary
Applied Materials is a global leader in materials engineering solutions for new chip and advanced display production.
The role involves developing new modules in Advanced Semiconductor Packaging, focusing on areas like bonding, micro bumps, and thermal management.
The company offers a supportive work culture, encourages career growth, and provides comprehensive benefits including potential bonus and stock awards.
Matching Summary
Applied Materials is a global leader in materials engineering solutions for new chip and advanced display production.
Salary
$180,000.00 - $247,500.00; Not specified; Not specified
Skills & Requirements
Must-have
Heterogenous Integration
Advanced Packaging
W2W/D2W bonding
micro bumps
TSV
thermal management
multi-wafer stacking
Nice-to-have
Structured problem-solving methodology
Innovation and ideation
Thought leader
Supportive work culture
Self-starter
Team player
Key Requirements
MS/PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent
10+ years of experience in advanced packaging
Strong communication skills
Proven track record of managing customer engagements