Packaging Engineer - High Voltage

Texas Instruments

Oita, Japan
Not specified
High voltage packaging design
High power module development
Gan, sic, igbt technologies
Texas Instruments is seeking a Packaging Engineer specializing in high voltage applications to lead a team responsible for designing and developing semiconductor packaging solutions. The ideal candidate will have extensive experience in high voltage (200-3300V) packaging technologies and a strong background in materials and manufacturing processes

Job Summary

  • Lead a high-performing team to define, design, develop, and scale high voltage packages and high power modules for various markets.
  • Identify prototype/subcon partners, assess manufacturing capabilities, and drive completion of first article builds.
  • Outline package reliability plans, complete testing, summarize failure modes, and provide solutions to address issues.

Matching Summary

Match Score: 85

Texas Instruments is seeking a Packaging Engineer specializing in high voltage applications to lead a team responsible for designing and developing semiconductor packaging solutions. The ideal candidate will have extensive experience in high voltage (200-3300V) packaging technologies and a strong background in materials and manufacturing processes.

Skills & Requirements

Must-have

  • High voltage packaging design
  • High power module development
  • GaN, SiC, IGBT technologies
  • Material supplier landscape knowledge
  • Cross-functional team collaboration

Nice-to-have

  • Market trend analysis
  • Prototype assessment
  • New process flow development
  • International conference presentation

Key Requirements

  • 10+ years of experience
  • BS degree in Engineering
  • Proficiency in English and Japanese
  • High Voltage (200V-3300V) experience

Work Rights

Not specified

Tailored Resume

Cover Letter