Base: $90,800.00-$121,100.00; bonus/equity: not sp...
Bachelor's degree in technical discipline
Experience with plasma etch or thin film deposition
Hands-on wafer fabrication and pilot lot processing
The role involves designing and implementing new wafer fab processes including plasma etch, thin film deposition, and lithography for next-generation infrared detectors
Job Summary
The role involves designing and implementing new wafer fab processes including plasma etch, thin film deposition, and lithography for next-generation infrared detectors.
Candidates will own specific tools, characterize wafers using SEM/FIB, and drive statistical process control practices to support aggressive technology goals.
The company offers a competitive salary range of $90,800-$121,100 along with comprehensive benefits including health insurance starting day one and a 401(k) match.
Matching Summary
The role involves designing and implementing new wafer fab processes including plasma etch, thin film deposition, and lithography for next-generation infrared detectors.
Salary
Base: $90,800.00-$121,100.00; Bonus/Equity: Not specified; Benefits: Health, Dental, Vision, Life Insurance, 401(k) Match, Stock Purchase Plan
Skills & Requirements
Must-have
Bachelor's degree in technical discipline
Experience with plasma etch or thin film deposition
Hands-on wafer fabrication and pilot lot processing
Proficiency in SEM, FIB/SEM, and metrology tools
Ability to automate and improve existing processes
Nice-to-have
Fluency in Python, MATLAB, JMP, or SQL
Familiarity with Statistical Process Control (SPC)
Knowledge of Lean Six Sigma problem-solving methods
Experience with infrared detector technology
Strong collaborative and self-directed work style
Key Requirements
U.S. citizenship or Permanent Resident status required
0-5 years of related experience desired
Direct experience with semiconductor or MEMS fabrication tools