Packaging Module Development Engineer

Intel Retiree Medical Plan Trust

Kulim, Malaysia
Smt process solutions development
Printed circuit boards (pcbs) technology
Failure analysis and root cause
Develop and validate board assembly process solutions to meet Intel's next-generation product requirements, including creating SMT process solutions for Intel IC packages and sockets

Job Summary

  • Develop and validate board assembly process solutions to meet Intel's next-generation product requirements, including creating SMT process solutions for Intel IC packages and sockets.
  • Design and optimize SMT processes, evaluate materials, and collaborate with cross-functional teams for process integration into manufacturing lines.
  • Contribute to technology roadmaps for SMT and PCB advancements, focusing on miniaturization, higher interconnect densities, and improved thermal and electrical performance.

Matching Summary

Develop and validate board assembly process solutions to meet Intel's next-generation product requirements, including creating SMT process solutions for Intel IC packages and sockets.

Skills & Requirements

Must-have

  • SMT process solutions development
  • Printed Circuit Boards (PCBs) technology
  • Failure analysis and root cause
  • Prototype board assembly and testing
  • Statistical data analysis

Nice-to-have

  • Analytic problem solver
  • Good communicator
  • Experimenter

Key Requirements

  • 4+ years experience (Bachelor's)
  • 3+ years experience (Master's)
  • 2+ years experience (Ph.D.)
  • Semiconductor IC assembly experience
  • Process and equipment understanding

Work Rights

Not specified

Tailored Resume

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