Senior Wire Bonding Manufacturing / Process Development Engineer
Teledyne Technologies Incorporated
Base: $113,600.00-$151,400.00; bonus/equity: not s...
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Automated wire bonding process development
Design of experiments (doe) statistical analysis
Root cause corrective action (rcca)
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Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes within microelectronics manufacturing. The ideal candidate will have a strong background in microelectronics, hands-on experience with automated wire bonders, and a commitment to continuous improvement.
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Job Summary
The role involves developing and sustaining automated wire bonding processes to ensure production readiness and process robustness in microelectronics manufacturing.
Engineers must lead Design of Experiments and statistical analysis to improve yield while defining process controls compliant with industry standards like MIL-STD-883.
This position requires serving as the equipment owner for automated wire bonders and implementing upgrades to enhance reliability and operator safety.
Matching Summary
Match Score: 75
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Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes within microelectronics manufacturing. The ideal candidate will have a strong background in microelectronics, hands-on experience with automated wire bonders, and a commitment to continuous improvement.
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Salary
Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Automated wire bonding process development
Design of Experiments (DOE) statistical analysis
Root cause corrective action (RCCA)
Equipment qualification and maintenance
Process control documentation creation
Nice-to-have
Aerospace or defense high-reliability environment
MES systems and digital process tools
Cross-functional project leadership skills
Lean manufacturing and 5S implementation
Training operators and technicians effectively
Key Requirements
Bachelor's degree in Engineering or related field
3+ years experience in microelectronics manufacturing