Senior Wire Bonding Manufacturing / Process Development Engineer

Teledyne Technologies Incorporated

Base: $113,600.00-$151,400.00; bonus/equity: not s...
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Automated wire bonding process development
Design of experiments (doe) statistical analysis
Root cause corrective action (rcca)
** Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes within microelectronics manufacturing. The ideal candidate will have a strong background in microelectronics, hands-on experience with automated wire bonders, and a commitment to continuous improvement. **

Job Summary

  • The role involves developing and sustaining automated wire bonding processes to ensure production readiness and process robustness in microelectronics manufacturing.
  • Engineers must lead Design of Experiments and statistical analysis to improve yield while defining process controls compliant with industry standards like MIL-STD-883.
  • This position requires serving as the equipment owner for automated wire bonders and implementing upgrades to enhance reliability and operator safety.

Matching Summary

Match Score: 75

** Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes within microelectronics manufacturing. The ideal candidate will have a strong background in microelectronics, hands-on experience with automated wire bonders, and a commitment to continuous improvement. **

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Automated wire bonding process development
  • Design of Experiments (DOE) statistical analysis
  • Root cause corrective action (RCCA)
  • Equipment qualification and maintenance
  • Process control documentation creation

Nice-to-have

  • Aerospace or defense high-reliability environment
  • MES systems and digital process tools
  • Cross-functional project leadership skills
  • Lean manufacturing and 5S implementation
  • Training operators and technicians effectively

Key Requirements

  • Bachelor's degree in Engineering or related field
  • 3+ years experience in microelectronics manufacturing
  • Must be US Citizen or PERM Resident

Work Rights

Must have US citizenship or PERM Resident status

Tailored Resume

Cover Letter